Hole Filling Electroplating configured for production capacity, process sequence, rack, jig or product handling matched to part geometry, utilities, safety and traceability requirements.
Final specification is developed after reviewing the product, process, capacity, plant layout, utilities and applicable standards.
Hole Filling Electroplating systems are designed for advanced PCB, HDI and semiconductor applications requiring reliable copper via filling, microvia filling and high-density interconnection.
ES-PRO provides customized copper electroplating solutions with optimized current distribution, electrolyte circulation, filtration, temperature control and chemical management to achieve void-free filling, uniform copper deposition and stable plating thickness. The system can be configured for blind vias, through holes, microvias and other high-aspect-ratio features according to board design, hole geometry, production capacity and process requirements.
The displayed flow is an engineering reference. The final sequence, chemistry, dwell time and control points are confirmed for the customer’s process.
Hole filling electroplating is widely used in advanced electronic manufacturing where high-density interconnection, reliable conductivity and void-free copper filling are required.
HDI printed circuit boards
Microvia and blind via filling
Semiconductor substrates
IC packaging substrates
Through-hole copper filling
High-density multilayer PCBs
Automotive electronics
Communication and high-frequency electronic products
Specialized Plating LinesCustomized chemical and electrolytic stripping lines for controlled removal of existing coatings before rework, recovery or replating.
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Specialized Plating LinesThe Vibratory Electroplating Pilot Line is designed for precision electroplating trials and process development of small, delicate, and complex-shaped components. Featuring a controlled vibratory plating system, the line enables uniform coating deposition, stable processing conditions, and reduced component damage. It supports testing and optimization of plating parameters, coating quality, and process efficiency before implementation in full-scale production.
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Specialized Plating LinesPCB Plating Line configured for production capacity, process sequence, rack, jig or product handling matched to part geometry, utilities, safety and traceability requirements.
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Specialized Plating LinesVacuum Plating is a process that deposits a thin layer of metal or compound onto a product’s surface in a vacuum chamber. It provides a uniform, durable, and attractive finish with improved wear and corrosion resistance.
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