PCB Plating Line configured for production capacity, process sequence, rack, jig or product handling matched to part geometry, utilities, safety and traceability requirements.
Final specification is developed after reviewing the product, process, capacity, plant layout, utilities and applicable standards.
PCB plating lines are designed for controlled metal deposition on printed circuit boards to achieve reliable conductivity, through-hole coverage and consistent surface quality.
ES-PRO provides customized PCB plating systems integrating pre-treatment, activation, electroless and electrolytic plating, rinsing, filtration, rectifiers and process control. Each line is configured according to board type, plating thickness, production capacity and required electrical performance.
The displayed flow is an engineering reference. The final sequence, chemistry, dwell time and control points are confirmed for the customer’s process.
PCB plating lines are widely used for circuit boards that require reliable conductive layers, uniform metal deposition and stable electrical performance.
Printed circuit boards (PCB)
Multilayer circuit boards
Through-hole plated boards
High-density interconnect (HDI) boards
Electronic control boards
Communication and telecom boards
Automotive electronics
Industrial and consumer electronic products
Specialized Plating LinesCustomized chemical and electrolytic stripping lines for controlled removal of existing coatings before rework, recovery or replating.
View system →
Specialized Plating LinesThe Vibratory Electroplating Pilot Line is designed for precision electroplating trials and process development of small, delicate, and complex-shaped components. Featuring a controlled vibratory plating system, the line enables uniform coating deposition, stable processing conditions, and reduced component damage. It supports testing and optimization of plating parameters, coating quality, and process efficiency before implementation in full-scale production.
View system →
Specialized Plating LinesVacuum Plating is a process that deposits a thin layer of metal or compound onto a product’s surface in a vacuum chamber. It provides a uniform, durable, and attractive finish with improved wear and corrosion resistance.
View system →
Specialized Plating LinesHole Filling Electroplating configured for production capacity, process sequence, rack, jig or product handling matched to part geometry, utilities, safety and traceability requirements.
View system →Share your process and project requirements with the ES-PRO engineering team.
Hello! I am ES-PRO’s technical advisory assistant. I can help with products, production-line solutions and technical services.
AI-assisted guidance. Final specifications are confirmed by ES-PRO engineers. · Your conversation is saved on this device. privacy policy