Automated plating line for semiconductor components

The customer required an automated plating line for small semiconductor components with stable production quality and reduced manual handling.

The main requirements included:

• Consistent plating thickness and surface quality

• Accurate control of current, voltage, plating time and bath temperature

• Stable positioning and transfer of small parts and plating racks

• Effective rinsing between chemical processes to reduce solution carry-over

• DI water rinsing for processes requiring higher cleanliness

• Independent filtration and circulation for critical plating tanks

• Recipe control for different products and plating parameters

• Automatic monitoring of tank level, temperature and equipment status

• Production record and alarm history for traceability

• Safe operation with interlocks for hoists, tanks and process equipment

ES-PRO Solution

Based on the customer’s process flow and production requirements, ES-PRO designed the line with automatic transfer, process control and supporting utility systems.

The system included:

• Automatic hoist transfer between process tanks

• PLC-controlled process timing and equipment sequence

• Rectifier control according to each plating recipe

• Temperature and liquid-level monitoring

• Chemical circulation and filtration systems

• Multi-stage rinse and DI water rinse sections

• Exhaust collection for chemical tanks

• HMI and SCADA screens for operation and monitoring

• Recipe storage and parameter management

• Alarm recording and production data logging

• SQL database for batch and historical process records

The completed line reduced manual product transfer, improved repeatability between production batches and provided clearer control and recording of key plating parameters.

The system was designed around the customer’s actual product size, plating process, rack arrangement, production capacity and available factory space.